Microelectronics Process Engineer
Sanmina View all jobs
- Kanata, ON
- $90,000-120,000 per year
- Permanent
- Full-time
- Process Development & Implementation: Manage and develop new processes for the assembly of Optical and Microelectronic modules, including:
- Die bonding of discrete active components.
- Wirebonding (wedge, ball and ribbon) gold and aluminum.
- Solder based die bonding (AuSn or similar)
- Hermetic sealing of ceramic or metal packages, including its validation (leak testing).
- Engineering Support: Provide process engineering solutions to product design and development teams, ensuring manufacturability and supporting NPI and manufacturing ramp-up.
- Project Management: Manage project timelines and deliverables for various customer projects, ensuring milestones are met.
- Equipment & Automation: Develop and implement application programs on high-end automated assembly equipment (e.g., dispensers, die bonders, wirebonders, sealers). Research, procure, and qualify new equipment and tooling.
- Troubleshooting & Improvement: Analyze and troubleshoot process performance issues. Conduct research into complex engineering problems to develop new operating policies and capabilities. Implement and suggest engineering changes for continuous improvement.
- Documentation & Guidance: Create comprehensive process assembly documentation. Provide technical guidance and mentorship to less experienced team members.
- DFx/Yield Optimization: Provide Design for X (DFx) feedback to internal and external design teams to optimize product manufacturability, improve yields, and increase throughput.
- Education: University degree in Engineering.
- Experience: Minimum 8 years of experience in a Process or Manufacturing Engineering role.
- Technical Expertise:
- Deep experience with Optical and Microelectronic technologies and processes.
- Required background in executing "best practice" process control.
- Experience with lean manufacturing principles.
- Proficiency with AutoCAD/SolidWorks.
- Experience with Microsoft Office Suite.
- Experience with wafer level processing (packaging, backend wafer processing).
- Hands-on build experience (handling bare dies, miniature components, microscopes).
- Experience with equipment programming (auto dispensers, pick and place machines).
- Exposure to product design and development phases.
- Experience with Design for Manufacturing (DFM) and Failure Mode and Effects Analysis (FMEA).
- Strong project and customer management skills.
- The compensation range for this position is $90,000 - $120,000 annually.
- This position is for an existing vacancy.
- The hiring process for this position does not use Artificial Intelligence (AI).