Head of Intra Data Center Platforms

• Define and deliver a strategy for silicon ASICs (multi-terabit) and the architecture of co-packaged optics platforms across inter / intra Data Center.
• Define cross-domain system architecture (ASIC, optics, PCB, backplane, cooling) to meet AI network requirements in performance, cost, power, space, efficiency, telemetry, and modularity
• Lead definition of integrated system development: hardware, optics, thermal, cooling, and packaging
• Collaborate with hyperscaler and service provider customers to align product features with real-world deployment needs
• Lead innovation in co-packaged optics, open standards, and partner ecosystems (Inphi, OIF, IEEE)
• Evangelize AI networking advantages/impacts to enterprise, hyperscalers, and service providers
• Gain industry mindshare, publish in leading conferences, represent the company in standards bodies, and foster R&D and academic partnerships
• Partner / Mentor team as well as cross organizations in R&D, PLM, Marketing, Services, and Sales, ensuring company success

• Ph.D. or equivalent in EE, IC, Optical/Network Architecture
• 15+ years in high-performance system architecture: ASICs, optics, PCB, thermal management
• Experience in defining and executing on multi-terabit platforms

Nokia